iPhone X-12 Double-stacked Board Separation & Recombination | REWA Academy Tips

Just Recently, REWA Academy students gave responses that the 2 layers commonly fail to fit very closely in double-stacked motherboard repair service There are also large gaps, triggering pseudo soldering In feedback, we will share tips as well as notes when separating and also recombining double-stacked motherboard Peel off foam on the motherboard prior to home heating Please be noted that we do not advise newbies to heat up the motherboard with a hot air gun Since the motherboard may receive heat unevenly and warp A specialist motherboard home heating platform is what we recommend To assist in later on elimination of the reasoning board, drive a screw on the logic board Puncture the tape with a Sculpture Knife The reasoning board and center layer are soldered with low-temperature solder paste So the most effective temperature for the heating platform will be 155 ° C-165 ° C Push the reasoning board gently with tweezers when the temperature gets to 165 ° C If the logic board hangs, the tin has actually melted Clamp the screw to remove the reasoning board Eliminate the signal board Eliminate thermal grease with a Sculpture Knife Thermal grease must be eliminated entirely Otherwise, the thermal oil will touch the reasoning board to trigger pseudo soldering in recombination Connect the signal board to the owner Use a round of Paste Flux Eliminate tin on the bonding pad with Soldering Iron at 365 ° C and also Solder Wick Tin on the bonding pad need to be totally gotten rid of The residual tin will certainly impact the subsequent soldering Clean the bonding pad with PCB Cleanser Clean the reasoning board with the very same method Please do not harm elements around the bonding pad of the logic board while cleaning It is essential to inspect if the bonding pad is cool after cleaning Affix the signal board to the Reballing Platform Placed the reballing stencil in setting to ensure that it is pushing against the signal board To stop the solder paste from streaming right into the motherboard gap, place a metal plate Use a layer of low-temperature Solder Paste Clean off excess solder paste with a Lint-free Wipe Remove the reballing stencil Examine if solder paste on the signal board is complete While using solder paste, please ensure that solder paste have to have a certain humidity If the solder paste is as well completely dry, it will certainly follow the reballing pattern when the stencil is eliminated Consequently, the solder paste on the signal board will not be uniform, which can easily result in bad soldering Put the signal board on the 165 ° C Heating System to heat Stop home heating after the solder balls are created Apply a small quantity of Paste Flux after the signal board has cooled Align the logic board with the signal board Keep home heating on the 165 ° C Heating System When the solder flux spills and logic board sinks, nudge the reasoning board delicately with tweezers to make sure the 2 layers fit carefully The push needs to be gentle and small Tidy the motherboard with PCB Cleanser after the motherboard has cooled If you discover the motherboard flawed while recombining, you can place the motherboard on a flat board as well as secure it with an elastic band Press 2 sides of the motherboard gently To prevent squashing components, please put a soft paper under the motherboard Next, we will certainly share an additional recombination technique The technique can be taken if the middle bonding pad is not harmed When the tin thaws, remove the logic board in a vertical manner with tweezers It can be seen that there is a steel pad of 0.05 mm thickness around the signal board at a certain range This steel pad is created to maintain a 0.05 mm gap between the logic board as well as the center layer, stopping the solder rounds from connecting while soldering You only need to eliminate thermal oil on the motherboard when the fixing is done Maintain initial tin on the bonding pad Use a small amount of Paste Flux Lastly, align the reasoning board with the signal board When the temperature level gets to 165 ° C and the tin melts, transform the power off Press 2 ends of the logic board with tweezers until the motherboard has cooled The reasoning board and also the signal board fit closely in this means There will be no linking as well as solder spheres spillover Check out REWA Academy if you intend to discover more repair abilities We have complete program plans for motherboard medical diagnosis and also repair capacity enhancement Click the web link in the remark area to buy motherboard fixing training course bundles Thanks for viewing and also do not hesitate to leave a remark

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